10AX115R1F40E1SG vs 10AX115R3F40E2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R1F40E1SG sa pamamagitan ng Intel at 10AX115R3F40E2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115R1F40E1SG | 10AX115R3F40E2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory | 68,857,560 bits (68.86 Mbit) | 68,857,856 bits (8,557 Kbit) |
| M20K Memory Blocks | [DATA_NEEDED: M20K count] | 2,738 |
| DSP Blocks | 342 | 1,518 (variable-precision, hard FP) |
| DSP Format | Variable-precision (fixed/floating-point) | — |
| Transceivers | [DATA_NEEDED: transceiver count for 10AX115 F40] | — |
| Transceiver Max Data Rate | 14.4 Gbps | — |
| Hard PCIe Cores | PCIe Gen3 x8 | — |
| Hard Memory Controllers | 2 | DDR4/DDR3/QDR IV |
| Maximum User I/O | 768 | 342 |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Core Voltage | 0.9 V | — |
| Speed Grade | R1 (commercial) | -2 |
| Temperature Grade | E1 (enhanced) | E2 (0C to +100C) |
| Packhaging | 1517-BBGA / FCBGA (F40), 40 x 40 mm | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Configuration Memory | — | Embedded (no external flash required for typical use) |