10M02DCU324A7G vs 10M02DCU324I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M02DCU324A7G sa pamamagitan ng Intel at 10M02DCU324I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M02DCU324A7G | 10M02DCU324I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | — |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | 160 |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Temperature ng Junction na Operasyon | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements (LEs) | — | 2,000 |
| Embedded Memory (M9K blocks) | — | 16 |
| Embedded Memory (bits) | — | 110,592 |
| Embedded Multipliers (18x18) | — | 16 |
| User I/O Banks | — | 8 |
| Packhaging | — | 324-ball UBGA (U324) |
| Pin/Pitch | — | 324 balls / 0.8 mm pitch |
| Process Node | — | 55 nm |
| Configuration Memory | — | On-chip dual-boot flash |
| Core Voltage (VCCINT) | — | 1.2 V |
| Analog Block | — | 12-bit SAR ADC with temperature sensor |
| Operating Temperature (Industrial) | — | -40C to +100C (I7 grade) |