10M02DCU324A7G vs 10M02DCU324I7G 比較
詳細並排比較 10M02DCU324A7G 由 Intel 與 10M02DCU324I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M02DCU324A7G | 10M02DCU324I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 2,000 | — |
| Embedded Memory | 110,592 bits | — |
| User I/O Count | 160 | 160 |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| 工作接面溫度 | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| 安裝類型 | Surface Mount | — |
| Process Technology | 55 nm embedded flash (TSMC) | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements (LEs) | — | 2,000 |
| Embedded Memory (M9K blocks) | — | 16 |
| Embedded Memory (bits) | — | 110,592 |
| Embedded Multipliers (18x18) | — | 16 |
| User I/O Banks | — | 8 |
| 封裝 | — | 324-ball UBGA (U324) |
| Pin/Pitch | — | 324 balls / 0.8 mm pitch |
| Process Node | — | 55 nm |
| Configuration Memory | — | On-chip dual-boot flash |
| Core Voltage (VCCINT) | — | 1.2 V |
| Analog Block | — | 12-bit SAR ADC with temperature sensor |
| Operating Temperature (Industrial) | — | -40C to +100C (I7 grade) |