10M04DAF256C7G vs 10M08DAF256C7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M04DAF256C7G sa pamamagitan ng Intel at 10M08DAF256C7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M04DAF256C7G | 10M08DAF256C7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | 8,000 |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | 387,072 bits (approx. 48 KB) |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Packhaging | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 256-pin LBGA (F256) |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| Tindminan RoHS | Compliant | Compliant (Pb-free "G" suffix) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | Yes | — |
| Embedded Memory (M9K blocks) | — | 46 (378 Kbits) |
| Maximum User I/O | — | 178 |
| Temperature na Operasyon | — | 0 °C to +85 °C (Commercial, "C" grade) |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| PLLs | — | 2 |
| 18 × 18 Multipliers | — | 24 |
| Configuration | — | Dual-configuration internal flash (D-series) |
| Internal Oscillator | — | Yes (on-chip) |