10M25DAF256C8G vs 10M25DAF256I7G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF256C8G sa pamamagitan ng Intel at 10M25DAF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF256C8G | 10M25DAF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 1,728 Kbits | 691,200 bits (1,638 Kbit) |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | 4 |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Packhaging | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Speed Grade | C8 | 7 |
| Temperature Grade | Commercial (0 °C to 85 °C) | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V (with 2.5 V analog supply) |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| User I/Os | — | 178 |
| Process Technology | — | 55 nm |
| Temperature na Operasyon | — | -40 °C to +100 °C (Industrial) |
| Embedded Multipliers (18x18) | — | 45 |
| User Flash | — | 2,048 Kbit (2 KB per CFM block) |
| Integrated ADC | — | Yes, 12-bit SAR |
| Configuration Method | — | On-chip non-volatile flash (CFM) |
| Supply Configuration | — | Dual-supply (DAF sub-family) |