5CSEBA4U19C6N vs 5CSEBA4U19A7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U19C6N sa pamamagitan ng Intel at 5CSEBA4U19A7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 5CSEBA4U19C6N 5CSEBA4U19A7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40,000 (40K LE) 40 K
Hard Processor System (HPS) Dual-core ARM Cortex-A9 MPCore with CoreSight —
Maximum HPS Clock Frequency 925 MHz —
Packhaging 484-pin UFBGA / UBGA (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
FPGA User I/O 161 (per Altera product page) —
Process Technology TSMC 28 nm low-power —
Memory Controller Hard controller for DDR2 / DDR3 / LPDDR2 —
DSP Blocks Variable-precision DSP blocks (18x18 multipliers) —
Embedded Memory M10K memory blocks 3.4 Mbits (M9K)
Encryption Support AES encryption (per LCSC listing) —
Error Detection SEU error detection and correction support —
Temperature na Operasyon 0C to +85C (commercial grade) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Tindminan RoHS Compliant Compliant
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Temperature ng Junction na Operasyon — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)
Level ng MSL — 3 (168 hours)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita