5CSEBA4U23C7SN vs 5CSEBA4U23C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U23C7SN sa pamamagitan ng Intel at 5CSEBA4U23C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ NakahandaIntel
5CSEBA4U23C6N - Cyclone V SE SoC FPGA 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA4U23C7SN | 5CSEBA4U23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | — |
| Maximum User I/Os | 364 | — |
| Packhaging | 672-ball UBGA, 23x23 mm | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Temperature na Operasyon | -40C to +85C (industrial) | — |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ |
| Speed Grade | C7 | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 40,000 |
| Embedded Memory (M10K + MLAB) | — | 2,460 Kbits |
| DSP Blocks (18x18 Multipliers) | — | 112 |
| HPS Processor Cores | — | Dual ARM Cortex-A9 MPCore |
| HPS Maximum CPU Clock | — | 925 MHz |
| Hard Memory Controller | — | DDR3 / DDR3L / LPDDR2 |
| Process Technology | — | TSMC 28 nm low-power |
| Core Voltage (VCC) | — | 1.1 V |
| General-Purpose FPGA I/Os | — | 188 |
| Transceivers | — | Not integrated on SE device |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Temperature ng Junction na Operasyon | — | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) |