A3PE3000-2FGG896 vs A3PE3000L-FGG896I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000-2FGG896 sa pamamagitan ng Microchip Technology at A3PE3000L-FGG896I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG896 ✓ NakahandaMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000-2FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E | ProASIC3L |
| Number of System Gates | 3,000,000 | — |
| Number of I/Os | 620 | — |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Speed Grade | -2 | Standard (no speed suffix) |
| Packhaging | 896-BGA / 896-FBGA (31x31 mm, 1.0 mm ball pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMD/SMT) |
| Temperature na Operasyon | 0C to 85C (TJ) | Industrial grade (I suffix) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) | — |
| Technology | CMOS flash | — |
| Soft ARM Support | Optional (per ProASIC3E datasheet) | — |
| Packaging | Tray | Tray, standard quantity 27 |
| Tindminan RoHS | ROHS3 Compliant (G suffix) | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| Total System Performance | [DATA_NEEDED: system performance] | — |
| System Gates | — | 3000000 |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Volte ng Pagbibigay | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Packhaging / Kaso | — | 896-BGA (FBGA, 1 mm pitch) |