A3PE3000L-FGG324 vs A3PE3000L-1FG324I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE3000L-FGG324 sa pamamagitan ng Microchip Technology at A3PE3000L-1FG324I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ NakahandaMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE3000L-FGG324 | A3PE3000L-1FG324I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L Low Power Flash FPGA |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | Non-volatile on-chip flash (single chip, secure) |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Supply Voltage na Operasyon | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Packhaging | 324-BGA / FBGA (FGG324) | 324-ball FBGA (FG324) |
| Style ng Pagpapasok | SMD/SMT | — |
| Temperature na Operasyon | 0 C to +70 C (commercial) | -40C to +100C (industrial, I suffix) |
| Packaging | Tray | — |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements | — | 35K LEs (75264 D-flip-flops equivalent family density) |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Speed Grade | — | -1 |
| Process Technology | — | 130 nm CMOS flash |
| Low Power Feature | — | Flash*Freeze technology |
| Uri ng Pagpapasok | — | Surface Mount |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |