A3PE600-FG484M vs A3P600-FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600-FG484M sa pamamagitan ng Microchip Technology at A3P600-FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FG484M ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600-FG484M | A3P600-FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | ProASIC3E (Flash-Based FPGA) | ProASIC3 |
| System Gates | 600000 | 600K |
| Logic Elements / Cells | 13824 | — |
| CLBs | 13824 | — |
| Maximum User I/O | 270 | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| Maximum System Frequency | 231 MHz | 231 MHz |
| Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage Range | 1.14 V to 1.575 V (nominal 1.5 V) | — |
| Configuration | Live-at-power-up flash fabric, single-chip (no external boot device) | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Packhaging | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch | 484-Pin FBGA (FGG484) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray (M suffix) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Lead Free |
| Distributor Stock Reference | 4480 pieces (Heisener listing) | — |
| Process Technology | — | 130 nm CMOS |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |