A3PE600-FG484M vs A3P600-FGG484 比較
詳細並排比較 A3PE600-FG484M 由 Microchip Technology 與 A3P600-FGG484 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FG484M ✓ 啟用中規格比較
| 參數 | A3PE600-FG484M | A3P600-FGG484 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3E (Flash-Based FPGA) | ProASIC3 |
| System Gates | 600000 | 600K |
| Logic Elements / Cells | 13824 | — |
| CLBs | 13824 | — |
| Maximum User I/O | 270 | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| Maximum System Frequency | 231 MHz | 231 MHz |
| Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage Range | 1.14 V to 1.575 V (nominal 1.5 V) | — |
| Configuration | Live-at-power-up flash fabric, single-chip (no external boot device) | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | — |
| 封裝 | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch | 484-Pin FBGA (FGG484) |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray (M suffix) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Lead Free |
| Distributor Stock Reference | 4480 pieces (Heisener listing) | — |
| Process Technology | — | 130 nm CMOS |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |