AFS600-1FG256K vs AFS600-FG256K Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-1FG256K sa pamamagitan ng Microchip Technology at AFS600-FG256K sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ NakahandaMicrochip Technology
AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-FG256K ✓ NakahandaPagsanggunian na paghahambing
| Parametro | AFS600-1FG256K | AFS600-FG256K |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | Fusion mixed-signal FPGA |
| Programmable Logic | Flash-based programmable logic | Flash-based CMOS programmable logic |
| Equivalent System Gates | 600,000 gates | — |
| Logic Cells | 13,824 logic cells | 13,824 logic cells |
| User I/O | 119 I/O | — |
| Maximum Frequency | 1282.05 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Integrated Analog | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Packhaging | 256-terminal plastic ball grid array (256-LBGA) | — |
| Terminal Count | 256 terminals | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.00 mm | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Uri ng Pagpapasok | Surface mount | Surface mount |
| Ordering Package Option | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | 0°C to 70°C |
| System Gates | — | 600,000 system gates |
| Configuration Technology | — | Nonvolatile flash configuration |
| Power-Off Retention | — | Program retained when powered off |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 metal layers |
| Logic Family | — | CMOS |
| Volte ng Pagbibigay | — | 1.5 V |
| Package Type | — | BGA-256, 1.0 mm pitch |
| Bilang ng Pin | — | 256 pins |
| ARM Support | — | Optional ARM support in the Fusion family |