AFS600-2FG484I vs M7AFS600-1FG484I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng AFS600-2FG484I sa pamamagitan ng Microchip Technology at M7AFS600-1FG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
AFS600-2FG484I AFS600-2FG484I - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FG484I - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FG484I Unknown
Microchip Technology
M7AFS600-1FG484I M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro AFS600-2FG484I M7AFS600-1FG484I
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Unknown Aktibo
Device Type Fusion mixed-signal FPGA —
System Gates 600,000 gates 600000
Programmable Logic Architecture Flash-based CMOS programmable logic —
Configuration Retention Nonvolatile when power is off —
Power-Up Configuration Live at power-up supported —
Integrated Analog Capability Configurable analog resources —
Embedded Memory Large flash memory blocks —
Clock Support Clock generation and management circuitry —
Packhaging 484-BGA 484-ball FBGA (FG484), 23 x 23 x 2.44 mm
Package Mounting Type Surface mount —
Speed Grade -2 1
Temperature Grade Industrial grade —
Logic Family CMOS CMOS
Bilang ng Pins 484 pins —
Core Supply Voltage [DATA_NEEDED: target AFS600-2FG484I supply voltage] —
Hanay ng Temperature na Operasyon [DATA_NEEDED: target AFS600-2FG484I operating temperature range] —
I/O Count [DATA_NEEDED: target AFS600-2FG484I I/O count] —
Analog ADC Count [DATA_NEEDED: target AFS600-2FG484I ADC count] —
Tindminan RoHS RoHS compliant Compliant
Lead-Free Status Lead free —
Programmable Logic Tiles — 110592
User I/O — 172
Family — Fusion (Flash FPGA with optional ARM CoreMP7 support)
Process Technology — 130 nm, 7-layer metal, Flash-based CMOS
Configuration Memory — Nonvolatile Flash, retains program when powered off
Power-Up Feature — Live at Power-Up (LAPU)
Supply Voltage (Core) — 1.5 V
Ball Pitch — 1.0 mm
Temperature na Operasyon — Industrial, -40C to +85C
Uri ng Pagpapasok — Surface Mount
Embedded Processor Support — ARM CoreMP7

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