DSP56301VF100 vs DSP56311VF150 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng DSP56301VF100 sa pamamagitan ng NXP Semiconductors at DSP56311VF150 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
DSP56301VF100 - 100MHz 24-bit Fixed-Point DSP, 252-MAPBGA | NXP
DSP56301VF100 Obsolete
Pagsanggunian na paghahambing
| Parametro | DSP56301VF100 | DSP56311VF150 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Type | Fixed-Point Digital Signal Processor | Fixed-Point Digital Signal Processor |
| Family | DSP56300 (DSP563XX series) | — |
| Core Clock Speed | 100 MHz | — |
| Instruction Throughput | 100 MIPS / 100 MMACS | 150 MIPS |
| Data Word Width | 24 bits (parallel X and Y data paths) | — |
| On-Chip RAM | 24 kB | 384 KB |
| On-Chip ROM (Non-Volatile) | 9 kB | — |
| I/O Voltage | 3.30 V | 3.30 V |
| Host Interface | Yes | — |
| Serial Interfaces | SSI (Synchronous Serial Interface), SCI (Serial Communication Interface) | Host Interface (HI), SSI, SCI |
| Timers | Triple Timer block | — |
| Packhaging / Kaso | 252-MAPBGA (21 x 21 mm) | — |
| Packaging | Tray | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | DSP56300 (Symphony) |
| Core Clock Frequency | — | 150 MHz |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Width ng Data Bus | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Input Logic Compatibility | — | TTL-compatible |
| Packhaging | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |