EP1C4F324C7 vs EP1C4F324C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1C4F324C7 sa pamamagitan ng Intel at EP1C4F324C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1C4F324C7 | EP1C4F324C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | — |
| Logic Elements | 4 000 | — |
| Logic Array Blocks / CLBs | 400 CLBs | — |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | — |
| Packhaging | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Temperature na Operasyon | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 130 nm |
| Tindminan RoHS | Compliant (lead-free FBGA) | — |
| Level ng MSL | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Device Family | — | Cyclone |
| Logic Elements (LE) | — | 4,000 |
| Logic Array Blocks (LAB) | — | 400 |
| Total RAM Bits | — | 78,336 |
| Embedded Multipliers (17x17) | — | 20 |
| M4K RAM Blocks | — | 17 |
| Maximum User I/Os | — | 249 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 |
| Internal Operating Frequency | — | 405 MHz |
| Configuration Method | — | SRAM-based, JTAG/Active Serial |