EP1K30FC256-3NAA vs EP1K30FC256-3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FC256-3NAA sa pamamagitan ng Intel at EP1K30FC256-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP1K30FC256-3NAA EP1K30FC256-3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Product Category FPGA - Field Programmable Gate Array —
Family ACEX-1K ACEX 1K
Number of Logic Elements 1728 —
Number of Gates 30000 (30K) —
Embedded RAM Bits 24576 bits —
Number of User I/Os 171 —
Maximum Internal Clock Frequency 200 MHz —
Core Supply Voltage 2.5 V 2.375 V to 2.625 V (nominal 2.5 V)
IC Process Technology 0.22 um —
Package Type 256-ball FBGA (FineLine BGA) —
Package Form 256-BBGA —
Uri ng Pagpapasok Surface Mount Surface Mount
Speed Grade -3 (ordering code) -3
Configuration Type SRAM-based, external configuration device required —
Hanay ng Temperature na Operasyon [DATA_NEEDED: operating temperature range] —
I/O Supply Voltage [DATA_NEEDED: VCCIO voltage options] —
Power Dissipation [DATA_NEEDED: typical power dissipation, design dependent] —
Lead-Free / RoHS [DATA_NEEDED: manufacturer PCN confirms RoHS status] —
Logic Elements / Cells — 17,288 logic elements (1,728 cells)
Typical Gates — 30,000
Total RAM Bits — 24,576
Number of LABs — 216
User I/Os — 171
Technology — 0.22 µm CMOS, SRAM configuration
Propagation Delay (typ.) — 0.6 ns
Maximum Frequency — 200 MHz
Packhaging — 256-ball FineLine BGA (FBGA-256)
Temperature na Operasyon — 0 °C to +70 °C (commercial)
Configuration — SRAM, serial/parallel, JTAG ISP (IEEE 1149.1)

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