EP1K30FC256-3NAA vs EP1K30FC256-3N Comparison

Detailed side-by-side comparison of EP1K30FC256-3NAA by Intel and EP1K30FC256-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FC256-3NAA EP1K30FC256-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $11.50 $17.50
Product Category FPGA - Field Programmable Gate Array β€”
Family ACEX-1K ACEX 1K
Number of Logic Elements 1728 β€”
Number of Gates 30000 (30K) β€”
Embedded RAM Bits 24576 bits β€”
Number of User I/Os 171 β€”
Maximum Internal Clock Frequency 200 MHz β€”
Core Supply Voltage 2.5 V 2.375 V to 2.625 V (nominal 2.5 V)
IC Process Technology 0.22 um β€”
Package Type 256-ball FBGA (FineLine BGA) β€”
Package Form 256-BBGA β€”
Mounting Type Surface Mount Surface Mount
Speed Grade -3 (ordering code) -3
Configuration Type SRAM-based, external configuration device required β€”
Operating Temperature Range [DATA_NEEDED: operating temperature range] β€”
I/O Supply Voltage [DATA_NEEDED: VCCIO voltage options] β€”
Power Dissipation [DATA_NEEDED: typical power dissipation, design dependent] β€”
Lead-Free / RoHS [DATA_NEEDED: manufacturer PCN confirms RoHS status] β€”
Logic Elements / Cells β€” 17,288 logic elements (1,728 cells)
Typical Gates β€” 30,000
Total RAM Bits β€” 24,576
Number of LABs β€” 216
User I/Os β€” 171
Technology β€” 0.22 Β΅m CMOS, SRAM configuration
Propagation Delay (typ.) β€” 0.6 ns
Maximum Frequency β€” 200 MHz
Package β€” 256-ball FineLine BGA (FBGA-256)
Operating Temperature β€” 0 Β°C to +70 Β°C (commercial)
Configuration β€” SRAM, serial/parallel, JTAG ISP (IEEE 1149.1)

Datasheets & Resources

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