EP1K30FI256-2N vs EP1K100FI256-2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K30FI256-2N sa pamamagitan ng Intel at EP1K100FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K30FI256-2N | EP1K100FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX 1K |
| Typical Gates | 30,000 | — |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| Maximum User I/O | 171 | 186 |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 200 MHz | — |
| Number of LABs | 216 | — |
| Packhaging | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA-256) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Speed Grade | -2 | -2 (faster bin) |
| Programmable via | JTAG (IEEE 1149.1) | — |
| Uri ng Memory | Dual-port Embedded Array Block (EAB) | — |
| Series | — | EP1K100 |
| Logic Elements | — | 4,992 |
| System Gates | — | 100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 6 |
| Total RAM Bits | — | 49,152 |
| I/O Supply Voltage | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Ball Finish | — | Leaded (SnPb) - 'N' suffix |
| Temperature na Operasyon | — | -40 °C to +85 °C (Industrial) |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial modes |
| Tindminan RoHS | — | Non-compliant (leaded 'N' ball finish) |