EP1S30F780C7AA vs EP1S25F780C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1S30F780C7AA sa pamamagitan ng Intel at EP1S25F780C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel
EP1S30F780C7AA ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP1S30F780C7AA | EP1S25F780C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix | Stratix |
| Logic Elements | 32,470 | 25,660 |
| Total Memory Bits | 3,317,184 | 1,944,576 bits |
| Maximum User I/O | 597 | — |
| Packhaging | 780-ball FCBGA (FineLine BGA) | 780-ball FC-FBGA (FineLine BGA) |
| Speed Grade | -7 | 7 |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Core Voltage | 1.5 V (VCCINT) | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X | — |
| DSP Blocks | Embedded multiplier blocks (9x9, 18x18, 36x36) | — |
| DSP Performance | Up to 2.1 GMACS at -7 speed grade | — |
| PLLs | Multi-PLL architecture | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Process Node | 0.13 µm SRAM | — |
| Level ng MSL | 3 (168 Hours) | [DATA_NEEDED: MSL level] |
| Packaging | Tray | — |
| LABs / CLBs | — | 2,566 LABs |
| User I/Os | — | 597 |
| Package Dimensions | — | 29 x 29 mm |
| Ball Pitch | — | 1 mm |
| Process Technology | — | 130 nm CMOS |
| Core Voltage (VCCINT) | — | 1.5 V |
| Internal Performance | — | up to 420.17 MHz |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |