EP1S30F780C7AA vs EP1S25F780C7 Comparison

Detailed side-by-side comparison of EP1S30F780C7AA by Intel and EP1S25F780C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP1S30F780C7AA EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel

EP1S30F780C7AA ⚠ Last Time Buy

Specification Comparison

Parameter EP1S30F780C7AA EP1S25F780C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $142.00 $195.00
Family Stratix Stratix
Logic Elements 32,470 25,660
Total Memory Bits 3,317,184 1,944,576 bits
Maximum User I/O 597 β€”
Package 780-ball FCBGA (FineLine BGA) 780-ball FC-FBGA (FineLine BGA)
Speed Grade -7 7
Operating Temperature 0C to +85C (commercial) 0C to +85C (Commercial)
Core Voltage 1.5 V (VCCINT) β€”
I/O Standards Supported LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X β€”
DSP Blocks Embedded multiplier blocks (9x9, 18x18, 36x36) β€”
DSP Performance Up to 2.1 GMACS at -7 speed grade β€”
PLLs Multi-PLL architecture β€”
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG β€”
Process Node 0.13 Β΅m SRAM β€”
MSL Level 3 (168 Hours) [DATA_NEEDED: MSL level]
Packaging Tray β€”
LABs / CLBs β€” 2,566 LABs
User I/Os β€” 597
Package Dimensions β€” 29 x 29 mm
Ball Pitch β€” 1 mm
Process Technology β€” 130 nm CMOS
Core Voltage (VCCINT) β€” 1.5 V
Internal Performance β€” up to 420.17 MHz
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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