EP1SGX25CF672I6N vs EP1SGX25CF672I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25CF672I6N sa pamamagitan ng Intel at EP1SGX25CF672I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP1SGX25CF672I6N EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

EP1SGX25CF672I6N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP1SGX25CF672I6N EP1SGX25CF672I7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family Stratix GX Stratix GX
Logic Elements / Cells 25,660 —
Configurable Logic Blocks (CLBs) 2,852 —
Logic Array Blocks (LABs) 2,566 —
User I/Os 455 —
Process Technology 130 nm CMOS 130 nm CMOS
Core Supply Voltage 1.5 V —
Packhaging 672-ball FBGA (FCBGA), 27 x 27 mm, 1 mm pitch 672-FBGA (FC-FBGA, FineLine BGA)
Temperature na Operasyon -40 °C to +85 °C (industrial) —
Temperature Grade Industrial —
Speed Grade 6 —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Lead-Free Yes —
Tindminan RoHS Compliant unknown
Toolchain Quartus II (Stratix GX device support) —
Logic Elements — 25,660
Combinational Logic Blocks (CLBs) — 2,566
Total Memory Bits — 1,944,576
LAB/CLB Rows — 455
Maksimum na Taktiko ng Oras — 4385.97 MHz (one source: 4.7 MHz)
Combinatorial Delay (CLB) — 9.48 ns (sibling datasheet figure)
Nominal Core Voltage — 1.5 V
Hanay ng Temperature na Operasyon — -65C to +135C (Military)
Ball Count — 672
Ball Pitch — 1.00 mm
Package Body Size — 27.00 x 27.00 mm
Programming Toolchain — Quartus II / Quartus Prime

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