EP2A40F672C6N vs EP2A40F672C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F672C6N sa pamamagitan ng Intel at EP2A40F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A40F672C6N EP2A40F672C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family APEX II APEX II
Logic Elements 40,000 —
Maximum System Gates 1,125,000 —
Embedded RAM Bits 442,368 —
Embedded System Blocks (ESBs) 160 —
Maximum User I/O Pins [DATA_NEEDED: maximum user I/O count] —
Core Voltage 1.5 V —
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V —
Packhaging 672-ball FineLine BGA —
Temperature na Operasyon Commercial (0C to +85C) —
Speed Grade C6 (per part number suffix) C8
Configuration Methods Passive Serial, Passive Parallel, JTAG —
Uri ng Pagpapasok Surface Mount —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Process Technology SRAM-based, 0.18 um (per family datasheet) —
PLL Count [DATA_NEEDED: PLL count] —
Series — EP2A40
Logic Family — CMOS
System Gates — 1.5 M
Logic Elements / Cells — 38,400
Maximum Operating Frequency — 376 MHz
Propagation Delay — 1.55 ns
Technology Node — 0.15 µm
Process Feature — All-layer copper, up to 8 metal layers
Nominal Supply Voltage (VCCINT) — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
User I/Os — 492
Number of Pins / Balls — 672
Package Type — FC-FBGA (FineLine BGA)
Package Dimensions — 27 x 27 mm
Ball Pitch — 1.0 mm
LVDS Data Rate — 1 Gbps
Embedded PLLs — 4
Programming Interface — JTAG (IEEE 1149.1)
Operating Temperature (Commercial) — 0 °C to 85 °C

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