EP2AGZ225FF35I4G vs EP2AGZ225FF35I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I4G sa pamamagitan ng Intel at EP2AGZ225FF35I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ225FF35I4G EP2AGZ225FF35I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ Arria II GZ
Logic Elements ~224,000 LE —
Process Node 40 nm —
Number of I/O 554 user I/O —
Package Type 1152-ball FineLine BGA (FBGA) —
Package Code FF35 —
Operating Temperature Grade Industrial (-40C to +100C) —
Speed Grade I4 —
Volte ng Pagbibigay [DATA_NEEDED: core VCC voltage] —
Embedded Transceivers Multi-gigabit (per datasheet) —
DSP Blocks Yes (per Arria II GZ family) —
Embedded Memory Yes (per Arria II GZ family) 14,248,960 bits (approx. 14.25 Mbit)
PCI Express Hard IP Yes (Gen1/Gen2) —
External Memory Interface DDR3 controller (per family) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: MSL rating]
Tindminan RoHS Compliant (per distributor listing) [DATA_NEEDED: RoHS status]
Lead-Free Yes (per distributor listing) —
Logic Elements (LE) — 224,000
Logic Array Blocks (LABs) — 8,960
User I/O Count — 554
Maximum Transceiver Data Rate — 6.375 Gbps
Transceiver Channels — 24
Process Technology — 40 nm
Core Voltage — 0.9 V
Temperature na Operasyon — -40C to +100C (Industrial)
Packhaging — 1152-ball FC-FBGA
Configuration Method — SRAM-based (volatile, requires external config device)
Maximum User I/O — 554

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita