EP2AGZ300FH29C4N vs EP2AGZ350FH29C3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29C4N sa pamamagitan ng Intel at EP2AGZ350FH29C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FH29C4N | EP2AGZ350FH29C3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | — |
| Logic Elements (LE) | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Adaptive Logic Modules (ALMs) | 119,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | 18,854,912 | — |
| User I/O Pins | 281 | 281 |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | — |
| Transceivers | Up to 28 (up to 6.375 Gbps) | 24 channels |
| Core Voltage | 0.9 V | — |
| Process Node | 40 nm | 40 nm TSMC |
| Packhaging | 780-ball FC-HFBGA (FH29) | 780-ball FBGA (HBGA, 29x29 mm) |
| Speed Grade | C4 | C3 (commercial, slowest) |
| Temperature Grade | Industrial (N suffix) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 350,000 |
| Embedded Memory (Bits) | — | 16,402,944 |
| Embedded Memory Blocks | — | [DATA_NEEDED: M9K/M144K block count] |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| PCI Express Hard IP | — | 4 x PCIe Gen2 (x1/x4) |
| External Memory Interface | — | DDR3 up to 800 MHz, DDR2, QDRII+ |
| PLLs | — | 8 (4 enhanced, 4 fast) |
| Global Clocks | — | 16 |
| Temperature ng Junction na Operasyon | — | 0C to +85C |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |