EP2C35F484I6N vs EP2C35F484I8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2C35F484I6N sa pamamagitan ng Intel at EP2C35F484I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2C35F484I6N EP2C35F484I8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Logic Elements 33,216 33,216
Logic Array Blocks (LABs) 2,100 —
Total RAM Bits 483,840 bits (483.84 Kbit on-chip) 483,840
Embedded 18x18 Multipliers 35 (Cyclone II family maximum 150) —
Phase-Locked Loops (PLLs) 4 —
Maximum User I/O Pins 322 (package-dependent; FBGA-484 supports up to 322 user I/O) —
Packhaging 484-ball FBGA (Fine-Pitch BGA) 484-BGA (FineLine BGA)
Logic Family CMOS —
Core Supply Voltage 1.2 V —
Hanay ng Temperature na Operasyon -40C to +85C (industrial) —
Maximum Internal Clock Frequency 402.5 MHz —
Process Node 90 nm TSMC CMOS —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Compliant Compliant (Pb-free)
Configuration Method Serial / Parallel (via Altera/Intel configuration device or JTAG) —
Series — Cyclone II
Family — Cyclone II EP2C35
Number of Logic Cells / Gates — 33,216
Number of I/O — 322 max user I/O
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Embedded Memory — 483,840 bits (M4K blocks)
Number of PLLs — 4
Temperature na Operasyon — -40C to +100C (industrial, I8)
Process Technology — 90 nm CMOS
Core Voltage — 1.2 V (typical)
Configuration Mode — AS / PS / JTAG / FPP
Level ng MSL — [DATA_NEEDED: MSL level]
Lead Free — Yes

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