EP2C8F256C6 vs EP2C8F256I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C8F256C6 sa pamamagitan ng Intel at EP2C8F256I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C8F256C6 | EP2C8F256I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Cyclone II | Cyclone II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 8,256 | — |
| Total RAM Bits | 165,888 | 165,888 |
| Number of I/O | 182 | — |
| Number of LABs/CLBs | 516 | [DATA_NEEDED: LAB count] |
| Number of Logic Elements/Cells | 8256 | — |
| Embedded Multipliers | 36 (18x18) | — |
| PLLs | 4 | 2 |
| Packhaging | 256-LBGA (FBGA) | — |
| Package Pin/Pin Count | 256 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Process Node | 90 nm | — |
| Volte ng Pagbibigay | 1.15 V to 3.3 V (bank-dependent) | — |
| Configuration Mode | AS / PS / JTAG | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant (Pb-free, lead-free reflow compatible) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LEs) | — | 8,256 |
| Embedded Memory Bits | — | 165,888 bits |
| Logic Blocks / Logic Cells | — | 540 (Logic Cells) |
| User I/O Pins | — | 182 |
| Embedded 18x18 Multipliers | — | Up to 36 |
| Global Clock Networks | — | 16 |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | — | 90 nm CMOS (SRAM-based) |
| Package Type | — | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM, loaded from external EPCS flash at power-up |