EP2S130F1020I4 vs EP2S180F1020I4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1020I4 sa pamamagitan ng Intel at EP2S180F1020I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2S130F1020I4 EP2S180F1020I4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family Stratix II Stratix II
Logic Elements 132,540 179,400
Equivalent LEs ~180,000 —
Adaptive Logic Modules (ALMs) 53,016 —
Embedded Memory (bits) 6,747,840 —
Embedded Memory (M512 blocks) 530 —
Embedded Memory (M4K blocks) 768 —
Embedded Memory (M-RAM blocks) 4 —
Embedded 18x18 Multipliers 504 —
DSP Blocks 48 —
User I/O Pins 742 —
User I/O Banks 12 —
Packhaging 1020-ball FC-FBGA (33x33 mm) —
Process Node 90 nm CMOS, all-layer copper —
Core Voltage (VCCINT) 1.2 V —
Speed Grade I (industrial performance) I4 (industrial speed grade 4)
Device Revision 4 —
Temperature ng Junction na Operasyon -40C to +100C (industrial) —
Configuration Scheme Fast Passive Parallel x8, Passive Serial, JTAG —
Uri ng Pagpapasok Surface Mount (FC-FBGA) Surface Mount
Tindminan RoHS Compliant (per distributor listings) RoHS Compliant
Configurable Logic Blocks (CLBs) — 8,970
Total RAM Bits — 9,383,040
User I/O Count — 742
Operating Temperature Grade — Industrial (-40C to +100C)
Core Voltage (typical) — 1.2 V
Process Technology — 90 nm CMOS
Package Type — FBGA-1020 (FineLine BGA)
Package Body Size — 33 x 33 mm
Ball Pitch — 1.0 mm
Lead-Free Status — Lead Free
Level ng MSL — [DATA_NEEDED: MSL level]

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