EP2SGX30CF780I4N vs EP2SGX30CF780I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780I4N sa pamamagitan ng Intel at EP2SGX30CF780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX30CF780I3 EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel

EP2SGX30CF780I3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX30CF780I4N EP2SGX30CF780I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Cells / CLBs 33,880 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.15 V to 1.25 V —
Maximum Internal Frequency 622.08 MHz 622.08 MHz
Embedded Transceivers 4 channels (up to 3.125 Gbps at C4) —
Packhaging 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch)
Pin / Terminal Count 780 —
Temperature na Operasyon -40C to +85C (Industrial) -40 °C to +85 °C (Industrial)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Lead-Free Yes —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status not confirmed in supplied data]
Uri ng Memory Embedded SRAM, external DDR/DDR2/QDR support —
Configuration JTAG / passive serial / fast passive parallel —
Logic Cells — 33,880
Logic Array Blocks (LABs) — 33,880
Number of User I/O Pins — 361
Core Voltage — 1.2 V
Transceivers — Embedded multi-gigabit transceivers (6.375 Gbps)
Terminal Pitch — 1.0 mm
Temperature Grade Suffix — I3 (Industrial)
Total Terminals — 780
Package Code — BGA, square shape

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