EP2SGX30DF780I4N vs EP2SGX30DF780I5N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780I4N sa pamamagitan ng Intel at EP2SGX30DF780I5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX30DF780I4N EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel

EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel

EP2SGX30DF780I4N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX30DF780I4N EP2SGX30DF780I5N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix II GX Stratix II GX
Logic Elements 33,880 —
Logic Blocks (CLBs) 33,880 —
Number of User I/O 361 —
Number of Inputs 361 —
Bilang ng Outputs 361 —
Total RAM Bits 1,369,728 bits —
Internal Clock Frequency 622 MHz —
Maksimum na Taktiko ng Oras 717 MHz —
Core Supply Voltage 1.2 V —
Process Technology 90 nm CMOS 90 nm CMOS
Temperature na Operasyon -40C to +85C (Industrial) -40C to +85C (Industrial)
Packhaging 780-pin FBGA (29 mm x 29 mm, 1 mm pitch) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Speed Grade I4 (Industrial, Speed Grade 4) I5
Lead Free Yes —
Tindminan RoHS Compliant —
Logic Cells — 33,880 (33,380 logic elements)
Logic Array Blocks (LABs) — 33,880
Core Voltage — 1.2 V
Internal Clock Frequency (max) — 622.08 MHz
Number of Transceivers — [DATA_NEEDED: transceiver count]
Number of Pins / Balls — 780
Package Type — FC-FBGA-780 (Flip-Chip Fine-pitch BGA)
Package Size — 29 x 29 mm, 1.0 mm pitch
Lead-Free / RoHS — Lead Free (per Kynix listing)
Temperature Grade Suffix — Industrial

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