EP2SGX60CF780C4 vs EP2SGX60CF780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60CF780C4 sa pamamagitan ng Intel at EP2SGX60CF780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60CF780C4 | EP2SGX60CF780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 3,022 | — |
| User I/O Count | 364 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | — |
| Internal Operating Frequency | up to 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Packhaging | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | — |
| Package Type | Flip-Chip Fine-Pitch BGA | 780-ball FC-FBGA |
| Speed Grade | C4 (commercial) | — |
| Temperature na Operasyon | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | Lead-free / Compliant |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Series | — | Stratix II GX |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| User I/O Pins | — | 364 |
| Embedded Memory (bits) | — | 2,544,192 |
| Number of CLBs | — | 60,440 |
| Internal Frequency (max) | — | 816.9 MHz |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| Package Dimensions | — | 29 mm x 29 mm, 1.0 mm pitch |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |