EP2SGX60DF780C3 vs EP2SGX60DF780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3 sa pamamagitan ng Intel at EP2SGX60DF780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
EP2SGX60DF780C4N ObsoletePagsanggunian na paghahambing
| Parametro | EP2SGX60DF780C3 | EP2SGX60DF780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements / Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | 2,544,192 |
| Number of I/O | 364 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | — |
| Internal Frequency (max) | ~717 MHz | — |
| Packhaging | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | — |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial, C speed grade) | — |
| Speed Grade | C3 (fastest commercial) | C4 |
| Tindminan RoHS | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Lead-free (per part suffix N) |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| User I/Os | — | 364 |
| Embedded Multipliers (18x18) | — | 144 |
| DSP Blocks | — | 36 |
| Transceivers | — | Up to 20 (up to 6.375 Gbps) |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Process Node | — | 90 nm CMOS |
| Maximum Internal Frequency | — | 717 MHz |
| Temperature na Operasyon | — | Commercial 0C to +85C |