EP3C10F256C8N vs EP3C10F256C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C10F256C8N sa pamamagitan ng Altera at EP3C10F256C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C10F256C8N | EP3C10F256C6 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | — |
| Logic Elements | 10,320 | — |
| Logic Array Blocks (LABs) | 645 | — |
| Embedded Memory (Bits) | 423,936 | — |
| User I/Os | 182 | — |
| Operating Frequency (max) | 402 MHz | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 2 |
| Packhaging | 256-pin FineLine BGA (FBGA-256, 17 x 17 x 1.8 mm) | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0 C to 85 C (Commercial, 'C' grade) | -40 C to +125 C (industrial, suffix 'C') |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Lead-Free | Yes | — |
| Level ng MSL | MSL3 (per JEDEC J-STD-020, typical for FineLine BGA) | 3 (168 hours) |
| Configuration Method | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG | — |
| Equivalent Gate Count | ~0.5 M Gates (approximate) | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| Maximum User I/Os | — | 182 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Speed Grade | — | 6 |