EP3C25F324I7N vs EP3C25F324C8 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324I7N sa pamamagitan ng Intel at EP3C25F324C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C25F324I7N EP3C25F324C8
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Family Cyclone III —
Logic Elements (LEs) 24,624 —
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) 608,256 bits
Embedded 18x18 Multipliers 66 —
Maximum User I/O Pins 215 —
LVDS Pairs 66 —
PLLs 4 4
Global Clock Networks 20 —
Process Technology 65 nm 65 nm CMOS, SRAM-based
Core Voltage 1.2 V 1.2 V
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) —
Packhaging 324-ball FBGA (Fine-Pitch BGA) 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Temperature na Operasyon -40C to +100C (Industrial) 0 °C to +85 °C (commercial)
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) —
Speed Grade 7 (slower speed grade, lower power) 8 (commercial)
Tindminan RoHS Compliant Non-compliant (per Lisleapex listing; original part number without 'N' suffix)
Lead-Free Yes —
Level ng MSL 3 (168 hours) —
Series — Cyclone III
Logic Elements — 24,624 LE
Logic Array Blocks — 1,539 LABs
Embedded Multipliers — 66 (18 x 18)
User I/Os — 215
Uri ng Pagpapasok — Surface Mount (BGA)
Maximum Internal Clock — 402 MHz

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita