EP3C40F324C8N vs EP3C25F324C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F324C8N sa pamamagitan ng Intel at EP3C25F324C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C40F324C8N | EP3C25F324C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (EP3C40) | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Embedded Memory (bits) | 1,161,216 (~1.16 Mbit) | — |
| Embedded 18x18 Multipliers | 126 | — |
| Maximum User I/O | 215 | — |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS (TSMC) | — |
| Maximum Core Frequency | 402 MHz (speed grade 8) | — |
| Temperature na Operasyon | 0C to +85C (commercial, C8 suffix) | 0 C to +85 C (commercial, suffix C) |
| Configuration Method | SRAM (volatile), requires external boot device | — |
| Packhaging | FBGA-324 (324-ball FineLine BGA) | 324-BGA (FineLine) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory (Kbits) | — | 608 Kbits |
| Number of I/O | — | 215 |
| Supply Voltage - Core | — | 1.2 V |
| Speed Grade | — | 8 |
| Total RAM Bits | — | 608,256 |
| Process Node | — | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | — | 66 |
| Number of PLLs | — | 4 |