EP3C40F780C7 vs EP3C40F780I8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780C7 sa pamamagitan ng Intel at EP3C40F780I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C40F780C7 EP3C40F780I8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Family Cyclone III Cyclone III
Logic Elements (LE) 39,600 —
Number of Logic Cells 39,600 —
Total Memory Bits 1,161,216 bits —
Embedded 18x18 Multipliers 126 —
Number of PLLs 4 4
User I/O Count 535 —
I/O Banks 8 20
Packhaging 780-ball FBGA (F780) 780-ball FBGA (F780)
Package Dimensions 29 x 29 mm —
Ball Pitch 1.0 mm —
Core Voltage (VCCINT) 1.2 V —
I/O Voltage (VCCIO) 1.2 V to 3.3 V —
Temperature na Operasyon 0C to +85C (Commercial) —
Speed Grade C7 —
Process Technology 60 nm TSMC low-power CMOS TSMC 65 nm low-power CMOS
Configuration Active Serial / Passive Parallel (JTAG) —
Level ng MSL 3 (168 hours) 3
Tindminan RoHS Compliant Compliant
Device Logic Elements — 39,600
Logic Array Blocks (LABs/CLBs) — 2,475
Embedded Memory (bits) — 1,161,216
Embedded Memory (Kbits) — 1,134
Embedded Multipliers (18x18) — 126
User I/O Pins — 535
Nominal Core Supply Voltage — 1.2 V (1.15 V to 1.25 V)
Package Ball Pitch — 1.0 mm
Operating Temperature Grade — Industrial (-40 °C to +100 °C junction)
Configuration Modes — Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel
Uri ng Pagpapasok — Surface Mount (BGA)

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