EP3C55F780C7 vs EP3C55F780C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C7 sa pamamagitan ng Intel at EP3C55F780C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C7 | EP3C55F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III FPGA |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 312 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Packhaging | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm low-power CMOS |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | C6 |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone III |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Maximum User I/O | — | 377 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |