EP3C55F780C7 vs EP3C55F780C6N 比較
詳細並排比較 EP3C55F780C7 由 Intel 與 EP3C55F780C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C55F780C7 | EP3C55F780C6N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone III | Cyclone III FPGA |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 312 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| 封裝 | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm low-power CMOS |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | C6 |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | Compliant | Compliant |
| Series | — | Cyclone III |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Maximum User I/O | — | 377 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| 工作溫度 | — | 0C to +85C (commercial) |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |