EP3CLS200F484C7N vs EP3CLS200F484C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C7N sa pamamagitan ng Intel at EP3CLS200F484C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS200F484C7N | EP3CLS200F484C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits (8.21 Mbit) |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Packhaging | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS, low-leakage |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Family | — | Cyclone® III LS |
| Logic Elements | — | 198,464 |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: exact LAB count] |
| Embedded Multipliers (18x18) | — | 396 |
| User I/O Pins | — | 210 |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum Operating Frequency | — | 402 MHz (fabric) |
| Speed Grade | — | 8 (slowest) |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Bitstream Encryption | — | AES-128 (256-bit key via separate license) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |