EP3SE110F1152C3N vs EP3SE110F1152C2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C3N sa pamamagitan ng Intel at EP3SE110F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F1152C3N EP3SE110F1152C2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Family Stratix III E Stratix III E (Enhanced)
Series Stratix III —
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) 4,300 4,300
Total RAM Bits 8,936,448 —
User I/Os 744 —
Operating Frequency (max) 500 MHz —
Core Supply Voltage 1.1 V nominal —
I/O Supply Voltage [DATA_NEEDED: I/O supply range] —
Process Technology 65 nm TSMC 65 nm
Package Type FC-FBGA-1152 (flip-chip BGA) —
Temperature na Operasyon 0 °C to 85 °C (commercial) 0C to 85C (Commercial)
Speed Grade C3 —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Style ng Pagpapasok SMD/SMT (Tray) —
DSP Blocks Yes (embedded multipliers) —
Uri ng Memory M9K and M144K block RAM —
External Memory Support DDR/DDR2/DDR3 with read/write leveling —
Boundary Scan IEEE 1149.1 (JTAG) —
RoHS [DATA_NEEDED: RoHS status] —
Lead-Free Yes (per Altera/Intel datasheet family convention) —
Logic Elements — 107,500
Adaptive Logic Modules (ALMs) — 53,750
Embedded Memory (bits) — 8,936,448
Maximum User I/Os — 744
Core Voltage — 0.9 V
Maximum Internal Frequency — 800 MHz
Packhaging — 1152-ball FC-BGA
Package Code — F1152
Device Type — FPGA
Configuration — SRAM-based, volatile (requires configuration device)

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