EP3SE110F780I3 vs EP3SE110F780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780I3 sa pamamagitan ng Intel at EP3SE110F780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780I3 | EP3SE110F780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107500 | — |
| Number of LABs/CLBs | 4300 | — |
| Number of Logic Elements/Cells | 107500 | — |
| Total RAM Bits | 8936448 | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 1.1 V core | — |
| Process Technology | 65 nm | 65 nm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | -40C to +100C (industrial) | — |
| Packhaging / Kaso | 780-BBGA, FCBGA (FineLine BGA) | — |
| Supplier Device Package | 780-FBGA | — |
| Tindminan RoHS | unknown | Compliant |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | unknown | — |
| Grade | Industrial | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Logic Array Blocks (LABs) | — | 4,300 |
| User I/Os | — | 488 |
| Packhaging | — | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| DSP Blocks | — | Yes (integrated, count varies by configuration) |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |