EP3SE260F1152C3 vs EP3SE260F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3 sa pamamagitan ng Intel at EP3SE260F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3 EP3SE260F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Aktibo
Series Stratix III E Stratix III E
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 10,200
User I/Os 744 —
Embedded 18x18 Multipliers 384 —
Packhaging 1152-ball FCBGA (Flip-Chip BGA) 1152-BBGA, FCBGA
Uri ng Pagpapasok Surface Mount Surface Mount
Core Voltage 0.9 V to 1.1 V 1.1 V
Process Technology 40 nm 65 nm
Temperature na Operasyon 0C to +85C (Commercial) 0 C to +85 C (Commercial)
Configuration Method Passive Serial / Fast Passive Parallel / JTAG —
PLLs 12 —
Tindminan RoHS Compliant Compliant
Speed Grade C3 —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
User I/O Count — 744
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita