EP3SE260F1152C4N vs EP3SE260F1152I4LN Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4N sa pamamagitan ng Intel at EP3SE260F1152I4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C4N EP3SE260F1152I4LN
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Aktibo
Series Stratix III E Stratix III
Family Stratix III (Enhanced) Stratix III E
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS —
Core Voltage 1.1 V 0.9 V (supports 1.05-1.15 V variant)
Maximum Operating Frequency 450 MHz —
Packhaging 1152-ball FC-FBGA (flip-chip) FCBGA-1152 (1517-ball)
Speed Grade -4 (commercial temperature) —
Temperature na Operasyon 0C to +85C (commercial, 'C' suffix) -40 C to +100 C (Industrial)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
Uri ng Memory SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Process Node — 65 nm CMOS
Logic Elements (LE) — 255,000
Logic Array Blocks (LAB) — 10,200
Embedded Memory Bits — 16,672,640
User I/Os — 744
Package Dimensions — 35 x 35 mm
Operating Frequency — Up to 717 MHz
Supply Voltage Range — 0.9 V core, 1.05 V-1.15 V supported
Tindminan RoHS — Compliant
Design Tool — Quartus II

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