EP3SE260H780C2N vs EP3SE260H780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C2N sa pamamagitan ng Intel at EP3SE260H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
EP3SE260H780C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780C2N | EP3SE260H780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 (16.7 Mbit) |
| User I/O Count | 488 | 488 |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Packhaging | 780-BGA FCBGA | 780-ball FCBGA (HBGA 33x33 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (flip-chip BGA) |
| Hanay ng Temperature na Operasyon | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C4 (middle/slow tier) |
| Level ng MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Reflow Peak Time Max | 40 s | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant (lead-free per datasheet) |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |