EP3SE260H780C2N vs EP3SE260H780C4L 比較
詳細並排比較 EP3SE260H780C2N 由 Intel 與 EP3SE260H780C4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780C2N | EP3SE260H780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | NRND |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | 16,672,768 (16.7 Mbit) |
| User I/O Count | 488 | 488 |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| 封裝 | 780-BGA FCBGA | 780-ball FCBGA (HBGA 33x33 mm) |
| 安裝類型 | Surface Mount | Surface Mount (flip-chip BGA) |
| 工作溫度範圍 | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C4 (middle/slow tier) |
| MSL 等級 | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Reflow Peak Time Max | 40 s | — |
| RoHS 狀態 | [DATA_NEEDED: rohs status] | Compliant (lead-free per datasheet) |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | Stratix III E |
| LABs/CLBs | — | 10,200 |
| 工作接面溫度 | — | 0C to +85C (commercial) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |