EP3SE260H780C4 vs EP3SE260H780C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4 sa pamamagitan ng Intel at EP3SE260H780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780C4 EP3SE260H780C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Aktibo
Family Stratix III E —
Logic Elements 255,000 —
Total Memory Bits 16,672,640 bits —
Logic Array Blocks (LABs) 10,200 —
User I/Os 488 488
Embedded Multipliers (18x18) 576 —
Distributed Memory 1,020 Kbits —
Number of PLLs 8 —
Core Voltage 0.9 V —
Auxiliary Voltage 1.1 V —
Process Technology 65 nm 40 nm CMOS
Speed Grade C4 —
Packhaging 780-ball FCBGA (H780) 780-BBGA, FCBGA (H780)
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS Compliant Compliant (lead-free 'N' suffix)
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
Number of Pins / Balls — 780
Temperature na Operasyon — 0 °C to +85 °C (C grade, commercial)
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
Transceivers — [DATA_NEEDED: number of embedded transceivers and max data rate]
DSP Blocks — [DATA_NEEDED: number of DSP blocks and precision]
Level ng Sensitivity sa Asid ng Moisture (MSL) — [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Configuration Method — SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita