EP3SE260H780C4L vs EP3SE50F780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4L sa pamamagitan ng Intel at EP3SE50F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780C4L | EP3SE50F780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements | 255,000 | — |
| LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 (16.7 Mbit) | — |
| User I/O Count | 488 | — |
| Packhaging | 780-ball FCBGA (HBGA 33x33 mm) | 780-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | C4 (middle/slow tier) | C4 (commercial, speed 4) |
| Core Voltage | 0.9 V (nominal) | 1.1 V |
| Temperature ng Junction na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | Compliant (lead-free per datasheet) | Compliant (lead-free) |
| Transceivers | Up to 24 multi-gigabit transceivers | [DATA_NEEDED: per Stratix III E variant] |
| Memory Interface | DDR3, DDR2, QDRII+, RLDRAM II controllers | — |
| Configuration Mode | PS, FPP, JTAG with EPCS/EPCQ | — |
| Series | — | Stratix III E |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory | — | 5,760,000 bits |
| User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Temperature na Operasyon | — | [DATA_NEEDED: full industrial/commercial grade] |
| PLLs | — | [DATA_NEEDED: PLL count] |