EP3SE260H780I4 vs EP3SL200H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4 sa pamamagitan ng Intel at EP3SL200H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780I4 | EP3SL200H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III |
| Logic Elements | 255,000 | — |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 8000 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Packhaging | 780-ball FC-HFBGA (HBGA) | — |
| Temperature na Operasyon | -40C to +100C (industrial, 'I' grade) | — |
| Speed Grade | 4 | I4 (industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Series | — | Stratix III L |
| Logic Elements (LE) | — | 200,000 |
| Embedded Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |