EP3SE260H780I4 vs EP3SL200H780I4 比較
詳細並排比較 EP3SE260H780I4 由 Intel 與 EP3SL200H780I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780I4 | EP3SL200H780I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III |
| Logic Elements | 255,000 | — |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 8000 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| 封裝 | 780-ball FC-HFBGA (HBGA) | — |
| 工作溫度 | -40C to +100C (industrial, 'I' grade) | — |
| Speed Grade | 4 | I4 (industrial) |
| 安裝類型 | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Series | — | Stratix III L |
| Logic Elements (LE) | — | 200,000 |
| Embedded Memory Bits | — | 10,901,504 |
| User I/O Count | — | 488 |
| DSP Multipliers (18x18) | — | 384 |
| Voltage - Core Supply | — | 1.1 V |
| Package Type | — | 780-BBGA / FCBGA (FC-HFBGA) |
| Package Dimensions | — | 33 mm x 33 mm |
| 工作接面溫度 | — | -40C to +100C (industrial) |
| Configuration Memory | — | SRAM-based, volatile |
| Design Tool | — | Quartus II (legacy) / Quartus Prime |