EP3SE260H780I4L vs EP3SE260H780I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4L sa pamamagitan ng Intel at EP3SE260H780I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780I4L | EP3SE260H780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Technology | 65 nm | 65 nm CMOS |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip) | Surface Mount (BGA) |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| Temperature na Operasyon | Industrial, -40C to +85C | -40C to +100C (industrial, 'I' grade) |
| Tindminan RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS compliance status] |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Logic Cells | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Packhaging | — | 780-ball FC-HFBGA (HBGA) |
| Speed Grade | — | 4 |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |