EP3SE260H780I4LG vs EP3SE260H780I4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4LG sa pamamagitan ng Intel at EP3SE260H780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I4LG EP3SE260H780I4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Series Stratix III Enhanced —
Family EP3SE260 Stratix III E (Enhanced)
Logic Elements 255,000 LE 255,000
Adaptive Logic Modules (ALMs) 102,000 ALM —
Embedded Memory 15.90 Mbit —
DSP Blocks 304 —
18x18 Multipliers 840 —
User I/O 488 —
PLLs 8 (4 fractional + 4 general-purpose) —
Speed Grade -4 —
Temperature Grade Industrial (I) —
Packhaging 780-ball FineLine BGA (HBGA) —
Temperature na Operasyon -40C to +100C Industrial, -40C to +85C
Process Technology 65 nm low-power CMOS 65 nm
Configuration Method JTAG / Passive Serial / Fast Passive Parallel / Active Serial —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
User I/O Count — 488
Core Voltage — 0.9 V
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Uri ng Pagpapasok — Surface Mount (flip-chip)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Tindminan RoHS — Compliant (lead-free)
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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